Semiconductor

Semiconductor Manufacturing Process Products

Back Grinding Tape

Dicing Tape

Tape for Die Bonding / Mounting Process

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Back Grinding Tape

214D

This product is used to protect the circuit surface from scratches, chipping, cracks and contamination by external foreign matter when backside grinding (back grinding) the wafer.



Product Name	Base Material	Thickness [mm]	Adhesive Strength [N/25mm] SUS Weak Side	Adhesive Strength [N/25mm] SUS Strong Side	Application	Technical Data
214D	Polyester	0.115	25	15	Grinding and cleaning process of semiconductor wafer

Dicing Tape

RMGU Series (UV Curing Type)

A tape for protecting and fixing the wafer during the semiconductor dicing process.



Product Name	Base Material	Thickness [mm]	Color	Adhesive Strength[mN/25mm] Before UV : SUS	Adhesive Strength[mN/25mm] After UV : SUS	Technical Data
RMGUY90	PVC	0.09	Blue/Opaque	600	900

Tape for die bonding / mounting process

170 Series

This product is surface protection and fixing tape using polyimide base material with high heat resistance and silicone adhesive. Therefore, in the high-temperature environment, adhesive residue is extremely few and peeling is easy.

171
*Die (semiconductor element) Masking (surface protection) tape for reflow process

172
*Die (semiconductor element) and leadframe mounting fixing tape



Product Name	Thickness [mm]	Structure	Adhesive Strength [N/25mm] SUS	Application	Notes	Technical Data
171	0.065	Polyimide film base Silicone adhesive layer Separator	0.1	Masking of semiconductor wafers	BTO
172	0.040	Polyimide film base Silicone adhesive layer Separator	8.0	Fastening of semiconductor package lead frame	BTO

FPC 【Flexible Printed Circuits】 Material



Product Name	Structure	Thickness （mm）	Width × Length （mm）×（M）	Feature	Notes	Technical Data
SAR25C12	Copper LCP	0.037	300mm×20M	Heat resistance Low dielectric property Low moisture absorption	BTO



Product Name	Structure	Thickness LCP （mm）	Thickness Copper （mm）	Feature	Notes	Technical Data
SAR CC	Copper LCP Copper	0.025	0.012	Heat resistance Low dielectric property Low moisture absorption	BTO

LCP Flexible Copper Clad Laminate 【SARAS C】 series File Download

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LCP Flexible Copper Clad Laminate 【SARAS C】 Basic Properties File Download

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Adhesive Sheet for FPC (Flexible Printed Circuit Board) bonding

SB Sheet Series

A Heat bonding film that has no tack at the beginning but can be bonded by heat. Adhesive applications such as semiconductor FPC materials.



Product Name	Thickness [mm]	Structure	Adhesive Strength [N/cm]	Application	Notes	Technical Data
SBN35	0.035	Epoxy Adhesive	8.0	For bonding flexible printed circuit board materials	BTO