LCP

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LCP Solution Cast Manufacturing Method

Film formation of liquid crystal polymer resin was mainly manufactured by a method called melt extrusion method.The melt extrusion method is a method in which molten resin can be extruded from a device into rolls to form a film.

 Due to the simple manufacturing method, the production efficiency is high and the cost is low. However, it is considered to be an unsuitable process for film production that requires high precision because it is difficult to control the film thickness and the surface is scratched by a die.In addition, the liquid crystal polymer resin has the property of being oriented when melted, so this production method also had the problem of varying strength.

 We have succeeded in developing a product that has both quality and productivity by a new method called the solution casting method, by improving the manufacturing method through research and development of liquid crystal polymer film.

 In the solution casting method, the raw material resin pellets are dissolved in an organic solvent.Then the solution is cast on a flat carrier film. Finally, it is a method of drying and molding.With this method, we have been able to manufacture high-quality products that solve the conventional problems and have high precision and no orientation.
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Product Name

Color

Thickness
(mm)

Melting point

Application

Notes

Technical Data

SAR13
Brown
0.013
280℃
Acoustic diaphragm
FPC for high speed large capacity communication
BTO
SAR20
Brown
0.02
280℃
Acoustic diaphragm
FPC for high speed large capacity communication
BTO
SAR35
Brown
0.035
280℃
Acoustic diaphragm
FPC for high speed large capacity communication
BTO
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Liquid Crystal Polymer (LCP) Film 【SARAS】 Series File Download
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Product Name

Structure

Thickness
(mm)

Width × Length
(mm)×(M)

Feature

Notes

Technical Data

SAR25C12
Copper
LCP
0.037
300mm×20M
Heat resistance
Low dielectric property
Low moisture absorption
BTO
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Product Name

Structure

Thickness
LCP
(mm)

Thickness
Copper
(mm)

Feature

Notes

Technical Data

SAR CC
Copper
LCP
Copper
0.025
0.012
Heat resistance
Low dielectric property
Low moisture absorption
BTO
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LCP Flexible Copper Clad Laminate 【SARAS C】 series File Download
LCP Flexible Copper Clad Laminate 【SARAS C】 Basic Properties File Download